Described herein is an open source invention relating to cryogenic processors and computing.
Here is a drawing that can be used to produce such a compurer case for mini-itx computer. It is designed to allow the addition of a low profile passive cooled single slot graphics card to be plugged in as well.
https://www.dropbox.com/s/0rjbma7sphp8shl/101.PDF?dl=0
As we know computers need to be kept cool. But what we need to understand is that temperature creates a positive feedback loop in computers. What a positive feedback loop is, is something that grows more when it gets bigger. Rolling a big snow ball is an example. The bigger it is, the faster it grows. the same is true for computer processors. The hotter it gets, the more energy it uses and therefore the hotter it gets. For any computer that doesn't burn up, an equilibrium is reached but the equilibrium temperature is usually quite hot so processors use up a lot of energy. Well we can run that feedback loop in reverse. If we get a processor cold, it will use less energy and thus produce less heat. What this means is that we can actually save energy by hypercooling a processor. This means that the energy required to cool the processor would be paid back and then some in energy savings of the processor. This is a really powerfully significant realization. Ultracooling a processor can actually save money and energy.
Well if cold is good then cryogenic is better. The reason why a processor uses less energy when it runs cold is that resistance goes down when the temperature decreases. So how can we cool our processors with liquid nitrogen? Thus far people have cooled thier processors with liquid nitrogen. The typical example is someone having a can on their processor that they pour liquid nitrogen into. This is a manual and non efficient process. One other method I have seen is someone running a compressed tank of liquid nitrogen through a cooling block on their processor. This requires a constant stream of liquid nitrogen which is not easy to reuse efficiently.
In this paper I will describe how to cool a processor and entire computer efficiently by submerging it in liquid nitrogen.
First a sealed case needs to be designed. Any materials will do. In a simple example of this two pieces of thick aluminum can be machined and hollowed out so they can be clamped or screwed (or any other attachment method) together inside of which resides the motherboard. For example 3 (or more or less) sides can be screwed together and one side left open to access computer ports or any other use. In order to make the hermetic or somewhat airtight seal, indium wire can be used. When indium wire is compressed between two pieces of material it forms a hermetic seal that tolerates even cryogenic temperatures. Any other method to seal it can be used too. In order to allow efficient transfer of heat, heat transfer components can be used within the case. For example a heat conductive block could be attached to the processor which in turn would be attached to the aluminum casing. Indium again can be used to make the connections. Indium can be used as a heat transfer material in processors and other uses. The indium can be melted to produce a better connection. Instead of added elements to improve heat transfer, these could also just be a part of the casing itself or other methods or a combination of methods.
The rest of the motherboard inside ideally would also be cooled well and kept dry. In order to do this ideally a heat conductive material better than air (but air can be used as well) would be used. Unfortunately not many liquids would stay liquid at this temperature so best to use dielectric powders and/or gasses. Helium is a good option however it can be difficult sealing the whole rig including the ports and all to not let the helium escape. A possibly ideal thing to use is a dielectric powder like a titanate or oxide powder. If a powder is used other powders or granules or gels or anything else with desired properties can be mixed in such as a desiccant powder, silica beads, or anything else. While not having the best properties (strontium and barium titanate may be better) titanium dioxide is very cheap and exhibits a high dielectric constant (important to protect the motherboard from frying itself) a high thermal conductivity (so it can act as a good coolant) and high specific heat (so it can hold lots of heat away from the motherboard). So what we can do is pack titanium dioxide powder into the casing holding the motherboard. This will allow the rest of the motherboard and components to be cooled by the liquid nitrogen efficiently not just the processor. If anything becomes too cold to function, methods to reduce the conductivity between the component and liquid nitrogen can be taken. This includes but is not limited to using insulative materials or thicker layers of lesser conductive materials like indium or any other method. The open spaces between the ports and the casing can be sealed using any sealant such as silicone sealant or any other method or material. This sealing may not be necessary but is probably beneficial in order to keep out any atmospheric air which contains moisture. This computer then would be partially or fully submerged into liquid nitrogen. Liquid nitrogen can be applied in any fashion not just submersion such as being sprayed with it or anything else. Liquid nitrogen need not be used, any method or combination of methods to cool the device can be used including water, oil, other cryogenic or cold liquids, gasses (including but not limited to nitrogen), or solids such as dry ice or anything cooler than the temperature of an uncooled processor.
One or many of these modules can be used separately or together. The devices can be connected or not connected together. Lowering the temperature as described herein can be done for any purpose such as increasing the clock speed of the processor, reducing the power consumption, increasing the longevity of the components, a combination of the above and/or anything else. The computer (or GPU or ASIC or any other processing or computing device) can be used for any purpose such as scientific experiments, cryptocurrency mining, server, personal computing, or anything else.
You are free to use, modify, sell, improve, create a business or anything else with the ideas or directions presented herin.
Here is a drawing that can be used to produce such a compurer case for mini-itx computer. It is designed to allow the addition of a low profile passive cooled single slot graphics card to be plugged in as well.
https://www.dropbox.com/s/0rjbma7sphp8shl/101.PDF?dl=0
As we know computers need to be kept cool. But what we need to understand is that temperature creates a positive feedback loop in computers. What a positive feedback loop is, is something that grows more when it gets bigger. Rolling a big snow ball is an example. The bigger it is, the faster it grows. the same is true for computer processors. The hotter it gets, the more energy it uses and therefore the hotter it gets. For any computer that doesn't burn up, an equilibrium is reached but the equilibrium temperature is usually quite hot so processors use up a lot of energy. Well we can run that feedback loop in reverse. If we get a processor cold, it will use less energy and thus produce less heat. What this means is that we can actually save energy by hypercooling a processor. This means that the energy required to cool the processor would be paid back and then some in energy savings of the processor. This is a really powerfully significant realization. Ultracooling a processor can actually save money and energy.
Well if cold is good then cryogenic is better. The reason why a processor uses less energy when it runs cold is that resistance goes down when the temperature decreases. So how can we cool our processors with liquid nitrogen? Thus far people have cooled thier processors with liquid nitrogen. The typical example is someone having a can on their processor that they pour liquid nitrogen into. This is a manual and non efficient process. One other method I have seen is someone running a compressed tank of liquid nitrogen through a cooling block on their processor. This requires a constant stream of liquid nitrogen which is not easy to reuse efficiently.
In this paper I will describe how to cool a processor and entire computer efficiently by submerging it in liquid nitrogen.
First a sealed case needs to be designed. Any materials will do. In a simple example of this two pieces of thick aluminum can be machined and hollowed out so they can be clamped or screwed (or any other attachment method) together inside of which resides the motherboard. For example 3 (or more or less) sides can be screwed together and one side left open to access computer ports or any other use. In order to make the hermetic or somewhat airtight seal, indium wire can be used. When indium wire is compressed between two pieces of material it forms a hermetic seal that tolerates even cryogenic temperatures. Any other method to seal it can be used too. In order to allow efficient transfer of heat, heat transfer components can be used within the case. For example a heat conductive block could be attached to the processor which in turn would be attached to the aluminum casing. Indium again can be used to make the connections. Indium can be used as a heat transfer material in processors and other uses. The indium can be melted to produce a better connection. Instead of added elements to improve heat transfer, these could also just be a part of the casing itself or other methods or a combination of methods.
The rest of the motherboard inside ideally would also be cooled well and kept dry. In order to do this ideally a heat conductive material better than air (but air can be used as well) would be used. Unfortunately not many liquids would stay liquid at this temperature so best to use dielectric powders and/or gasses. Helium is a good option however it can be difficult sealing the whole rig including the ports and all to not let the helium escape. A possibly ideal thing to use is a dielectric powder like a titanate or oxide powder. If a powder is used other powders or granules or gels or anything else with desired properties can be mixed in such as a desiccant powder, silica beads, or anything else. While not having the best properties (strontium and barium titanate may be better) titanium dioxide is very cheap and exhibits a high dielectric constant (important to protect the motherboard from frying itself) a high thermal conductivity (so it can act as a good coolant) and high specific heat (so it can hold lots of heat away from the motherboard). So what we can do is pack titanium dioxide powder into the casing holding the motherboard. This will allow the rest of the motherboard and components to be cooled by the liquid nitrogen efficiently not just the processor. If anything becomes too cold to function, methods to reduce the conductivity between the component and liquid nitrogen can be taken. This includes but is not limited to using insulative materials or thicker layers of lesser conductive materials like indium or any other method. The open spaces between the ports and the casing can be sealed using any sealant such as silicone sealant or any other method or material. This sealing may not be necessary but is probably beneficial in order to keep out any atmospheric air which contains moisture. This computer then would be partially or fully submerged into liquid nitrogen. Liquid nitrogen can be applied in any fashion not just submersion such as being sprayed with it or anything else. Liquid nitrogen need not be used, any method or combination of methods to cool the device can be used including water, oil, other cryogenic or cold liquids, gasses (including but not limited to nitrogen), or solids such as dry ice or anything cooler than the temperature of an uncooled processor.
One or many of these modules can be used separately or together. The devices can be connected or not connected together. Lowering the temperature as described herein can be done for any purpose such as increasing the clock speed of the processor, reducing the power consumption, increasing the longevity of the components, a combination of the above and/or anything else. The computer (or GPU or ASIC or any other processing or computing device) can be used for any purpose such as scientific experiments, cryptocurrency mining, server, personal computing, or anything else.
You are free to use, modify, sell, improve, create a business or anything else with the ideas or directions presented herin.
